W25Q64FV
6.2.31
Read Manufacturer / Device ID Dual I/O (92h)
The Read Manufacturer / Device ID Dual I/O instruction is an alternative to the Read Manufacturer /
Device ID instruction that provides both the JEDEC assigned manufacturer ID and the specific device ID
at 2x speed.
The Read Manufacturer / Device ID Dual I/O instruction is similar to the Fast Read Dual I/O instruction.
The inst ruction is initiated by driving the /CS pin low and shifting the instruction code “9 2 h” followed by a
24-bit address (A23-A0) of 000000h, but with the capability to input the Address bits two bits per clock.
After which, the Manufacturer ID for Winbond (EFh) and the Device ID are shifted out 2 bits per clock on
the falling edge of CLK with most significant bits (MSB) first as shown in Figure 30. The Device ID values
for the W25Q64FV is listed in Manufacturer and Device Identification table. The Manufacturer and Device
IDs can be read continuously, alternating from one to the other. The instruction is completed by driving
/CS high.
/CS
Mode 3
0
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
CLK
Mode 0
Instruction (92h)
A23-16
A15-8
A7-0 (00h)
M7-0
DI
(IO 0 )
6
4
2
0
6
4
2
0
6
4
2
0
6
4
2
0
DO
(IO 1 )
* = MSB
High Impedance
7
*
5
3
1
7
*
5
3
1
7
*
5
3
1
7
*
5
3
1
/CS
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
Mode 3
CLK
IOs switch from
Input to Output
Mode 0
DI
(IO 0 )
0
6
4
2
0
6
4
2
0
6
4
2
0
6
4
2
0
DO
(IO 1 )
1
7
*
5 3
MFR ID
1
7
*
5 3
Device ID
1
7
*
5 3
MFR ID
(repeat)
1
7
*
5 3
Device ID
(repeat)
1
Figure 30. Read Manufacturer / Device ID Dual I/O Instruction (SPI Mode only)
Note:
The “Continuous Read Mode” bits M(7 -0) must be set to Fxh to be compatible with Fast Read Dual I/O instruction.
- 58 -
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相关代理商/技术参数
W25Q64FVSFIG TR 制造商:Winbond Electronics Corp 功能描述: 制造商:Winbond Electronics Corp 功能描述:IC FLASH 64MBIT 104MHZ 16SOIC
W25Q64FVSFIP 制造商:WINBOND 制造商全称:Winbond 功能描述:3V 64M-BIT SERIAL FLASH MEMORY WITH DUAL/QUAD SPI & QPI
W25Q64FVSSIG 功能描述:IC SPI FLASH 64MBIT 8SOIC RoHS:是 类别:集成电路 (IC) >> 存储器 系列:SpiFlash® 标准包装:2,500 系列:- 格式 - 存储器:EEPROMs - 串行 存储器类型:EEPROM 存储容量:1K (128 x 8) 速度:100kHz 接口:UNI/O?(单线) 电源电压:1.8 V ~ 5.5 V 工作温度:-40°C ~ 85°C 封装/外壳:8-TSSOP,8-MSOP(0.118",3.00mm 宽) 供应商设备封装:8-MSOP 包装:带卷 (TR)
W25Q64FVSSIG TR 制造商:Winbond Electronics Corp 功能描述:SPIFLASH, 64M-BIT, 4KB UNIFORM 制造商:Winbond Electronics Corp 功能描述:IC FLASH 64MBIT 104MHZ 8SOIC 制造商:Winbond 功能描述:SPIFLASH, 64M-BIT, 4KB UNIFORM
W25Q64FVSSIG/TRAY 制造商:Winbond Electronics Corp 功能描述:
W25Q64FVSSIP 制造商:WINBOND 制造商全称:Winbond 功能描述:3V 64M-BIT SERIAL FLASH MEMORY WITH DUAL/QUAD SPI & QPI
W25Q64FVTCIG 制造商:Winbond Electronics Corp 功能描述:64MBIT SPI
W25Q64FVTCIP 制造商:WINBOND 制造商全称:Winbond 功能描述:3V 64M-BIT SERIAL FLASH MEMORY WITH DUAL/QUAD SPI & QPI